Call for Paper

ECWC15 Call for Paper

30 Nov 2020 Hong Kong Science Park and
Shenzhen Convention & Exhibition Center, China
In conjunction with “International Electronics Circuit Exhibition (Shenzhen)”

Submit Now

The 15th Electronic Circuits World Convention (ECWC15) is the most notable international PCB symposium held every three years in different cities around the world. ECWC provides a valuable platform to encourage learnings amongst peers and provide the latest on global PCB demand, PCB manufacturing processes as well as technologies to enable them to better cope with the changing market dynamics for trends such as 5G, autonomous driving, smart world and much more. It also aims to promote the domestic PCB industry and economic activities in every country and every region.

We welcome local and international papers and invite you to participate in this international event that occurs only every 3 years and share your experiences with peers in the PCB and electronics manufacturing industry. Here is the details of submission of an abstract for ECWC15:

 

Paper Scope

Technology
T1 Design and Development Tools  
T2 Materials, Components and Traceability 
T3 Manufacturing 
T3.1 Equipment  
T3.2 Technology
T3.3 Process Development
T3.4 Automation 
T4 Quality, Test and Life Cycle Management
T5 PCB Processes
T5.1 Chemical Technology
T5.2 Mechanical Technology
T5.3 Optical Technology
T6 Surface Mounting, Assembly and Interconnection
T7 Packaging Technology
T7.1 System in Package
T7.2 Wafer-Level Packaging
          T7.3 Panel-Level Packaging
T8 Energy Harvesting/Green Energy
T9 Application Specific Areas
T9.1 Automotive Electronics and Electromobility  
T9.2 Industrial and Power Electronics
T9.3 Aerospace and Defence 
T9.4 Medical Electronics 
T9.5 Consumer Electronics
T10 Advanced and Emerging Technologies
T11 5G Requirements on PCBs
T12 Smart Living Applications
T13 E-Textiles/Smart Textiles
T14 Printed Electronics/Printed Hybrid
Management
M1 Global Market Trends and Outlook 
M2 Supply Chain Management 
M3 Environment, Health and Safety 
M4 Business Models and Strategy 
M5 Certification and Qualifications 
M6 Total Cost of Ownership and Overall Equipment Efficiency (OEE) 
M7 Industry 4.0/Smart manufacturing
M8 Traceability/Blockchain
 

Date/Place

  • 30 November to 1 December 2020
  • Hong Kong Science Park, Shatin

      2 December 2020; 
      Shenzhen Convention & Exhibition Center, China; 
      International Electronics Circuit Exhibition (Shenzhen); 

 

Presentation Format

 

There are two opportunities for presenting your expertise: 

  • Oral Present
    These will be held within conference sessions addressing key elements of the same topic. Each presentation should last 20 minutes. An extra 5 minutes will be permitted for discussions and questions from the audience.
  • Poster Presentation
    The poster will be exhibited during the poster session.
 

Submission Deadline

Abstract submission: 1 December 2019 - 30 Apr 2020
Abstract acceptance notification: 31 May 2020
Full Paper SubmissionL 31 July 2020
Final acceptance notification: 31 August 2020
Oral Presentation (PPT)/ Poster presentation material submission: 31 October 2020

 

Selection Process

All submitted abstracts will be presented to the committee for selection. The acceptance of your abstract depends on the following criteria: technical aspect, market aspect, innovation, applicability and relevance of the conference themes. Punctuality and completeness are also criteria. The committee reserves the right to allocate abstracts to a different topic where suitable. 

 

Best Paper Award

The ECWC15 Program Committee will nominate the best abstracts out of all submissions. After the submission of the final papers, papers will be reviewed and judged based on the below criteria: Originality (weighting 40%) , Innovation (weighting 30%) and Quality of Argument (weighting 30%).

 

The Best Paper Award will be divided into: One Gold Award (Prize: HKD30,000), One Silver Award (Prize: HKD20,000), One Bronze Award (Prize: HKD10,000) and Ten Merit Award (Prize: HKD3,000) . The awards ceremony will take place on 2 December 2020 during ECWC15 conference.

Technical Committee Member

CHAIRMAN
Hong Kong Printed Circuit Association (HKPCA)
Ms. Audrey Sim
 Vice President & Executive Director - Operation & Administration
CO-CHAIRS
Hong Kong Productivity Council (HKPC)
Dr. Ming Ge
Principal Consultant, Smart Manufacturing and Materials Division
ZTE Corporation
Mr. Zhe Liu
Chief Engineer, Institute of Manufacturing Engineering
LOCAL TEAM
Gainbase Industrial Ltd.
Mr. Benny Yip
General Manager
Hong Kong Printed Circuit Association (HKPCA)
Dr. Kinny Yeung
Honorary Adviser
Huawei Technologies Co., Ltd
Mr. Andrew Ga
PCB material and process expert
Isola Asia Pacific (Hong Kong) Ltd.
Mr. Dick Leung
Senior Director, Sales – HK & Southern China
Lenovo Information Technology (Shanghai) Co., Ltd
Mr. Peter Deng
Advisory Engineer
MacDermid Performance Solutions Hong Kong Limited
Mr. Ringo Kwong
Business Director
Olympic Country Co Ltd
Mr. Daniel Chan, Vice President
Innovation and Business Development
Robert Bosch Co., Ltd.
Mr. James Tam
Project Manager
The Hong Kong Polytechnic University
Prof. Winco Yung, Professor
PhD, CEng, FHKIE, MIEEE, SrMHKSQ
TTM Technologies Inc.
Mr. Clay Zha
Vice President of Technology Solutions, Mobility BU
WECC TEAM
China Printed Circuit Association (CPCA)
Mr. Kevin Yan
Vice President
China Printed Circuit Association (CPCA)
Mr. Wang Cheng Yong
Vice General Manager
China Printed Circuit Association (CPCA)
Ms. Tang Yan Ling
Consultant
European Institute of Printed Circuits (EIPC)
Mr. Alun Morgan
President
European Institute of Printed Circuits (EIPC)
Ms. Tarja Rapala
Technical Director
Association Connecting Electronics Industries (IPC)
Mr. David Bergman
VP Standards & Technology
Association Connecting Electronics Industries (IPC)
Mr. Chris Jorgensen
Director Technology Transfer
Japan Electronics Packaging and Circuits Association (JPCA)
Prof. Hirofumi (Harry) Matsumoto
Fellow/Senior Advisor, Nippon Mektron, Ltd.
Japan Electronics Packaging and Circuits Association (JPCA)
Mr. Julian Bashore
Representative Director, MacDermid Performance Solutions Japan K.K.
Korea Printed Circuit Association (KPCA)
Mr. HyungKun Kim
Technical Advisor
Korea Printed Circuit Association (KPCA)
Mr. Minsu (Tim) Lee
Manager
Taiwan Printed Circuit Association (TPCA)
Mr. Michael Chang
Director, DuPont Taiwan Limited
Taiwan Printed Circuit Association (TPCA)
Mr. Jeffrey Lee, Assistant Vice President
iST-INTEGRATED SERVICE TECHNOLOGY INC

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Disclaimer

Any opinions, findings, conclusions or recommendations expressed in this material/event (or by members of the project team) do not reflect the views of the Government of the Hong Kong Special Administrative Region, the Innovation and Technology Commission or the Vetting Committee of the General Support Programme of the Innovation and Technology Fund.